JPH075650Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH075650Y2 JPH075650Y2 JP1989112147U JP11214789U JPH075650Y2 JP H075650 Y2 JPH075650 Y2 JP H075650Y2 JP 1989112147 U JP1989112147 U JP 1989112147U JP 11214789 U JP11214789 U JP 11214789U JP H075650 Y2 JPH075650 Y2 JP H075650Y2
- Authority
- JP
- Japan
- Prior art keywords
- optical sensor
- green sheet
- slit hole
- metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 241000562569 Riodinidae Species 0.000 description 12
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003292 diminished effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112147U JPH075650Y2 (ja) | 1989-09-26 | 1989-09-26 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112147U JPH075650Y2 (ja) | 1989-09-26 | 1989-09-26 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0351864U JPH0351864U (en]) | 1991-05-20 |
| JPH075650Y2 true JPH075650Y2 (ja) | 1995-02-08 |
Family
ID=31660598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989112147U Expired - Lifetime JPH075650Y2 (ja) | 1989-09-26 | 1989-09-26 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075650Y2 (en]) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6214760U (en]) * | 1985-07-10 | 1987-01-29 |
-
1989
- 1989-09-26 JP JP1989112147U patent/JPH075650Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351864U (en]) | 1991-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6467162B2 (en) | Method for mounting devices on a printed circuit board despite misalignment of resist | |
| JPH075650Y2 (ja) | 回路基板 | |
| JP3575523B2 (ja) | 電子装置用回路基板の製造方法 | |
| JPH05335438A (ja) | リードレスチップキャリア | |
| JPH0349418Y2 (en]) | ||
| JP2561642B2 (ja) | プリント配線板用部品位置決めマークの形成法 | |
| JPH01287937A (ja) | フィルムキャリアテープ | |
| JPH06326446A (ja) | 基板の製造方法及び基板 | |
| JPH0454377B2 (en]) | ||
| JPH0239591A (ja) | プリント板のペースト印刷方法 | |
| JPH0625981Y2 (ja) | セラミック基板 | |
| JPS6327856B2 (en]) | ||
| JPH0514541Y2 (en]) | ||
| JPH0528791Y2 (en]) | ||
| JPS63215060A (ja) | 半導体装置 | |
| JP2757349B2 (ja) | 混成集積回路用基板及びそれを用いた混成集積回路装置の製造方法 | |
| JPH0227831B2 (ja) | Purintohaisenban | |
| JPH0613741A (ja) | 表面実装部品用回路基板 | |
| JPH056867U (ja) | 印刷回路基板 | |
| JPH0623014Y2 (ja) | 混成集積回路用基板 | |
| JPH04121779U (ja) | Ｔｏｔ接続ランド | |
| JPH05327293A (ja) | チップの実装精度確認用ランド | |
| JPH0613139U (ja) | 配線基板 | |
| JPS6155931A (ja) | 厚膜混成集積回路装置の製造方法 | |
| JPH0655277U (ja) | 部品実装回路基板 |